Product Categories
E-mail subscription
For more information on PCB, Leave your E-mail Address.
Home>About Sentak > FAQ > PCBA PCBA
Analysis of common problems of PCBA circuit board in SMT patch production
During SMT processing and manufacturing of PCBA circuit board, some quality anomalies often occur, such as short circuit of SMT components, solder ball on the soldering plate, virtual welding and so on.
Modify PCB Layout with too wide/too long welding plate design
Open welding film between pads
Solder mask printing is not good for PCB incoming material control
Too much pressure on the printing paste reduces the pressure on the printing spatula
Solder powder oxidation, flux change solder paste
Adjust the furnace temperature curve by heating up too quickly in preheating zone
Too fast track speed reduces the reflow track speed
During SMT processing and manufacturing of PCBA circuit board, some quality anomalies often occur, such as short circuit of SMT components, solder ball on the soldering plate, virtual welding and so on.
From the following common reasons, we find some ways to share with our friends these common problems in SMT patch processing.
Modify PCB Layout with too wide/too long welding plate design
Open welding film between pads
The gap of welding plate is too small
Solder mask printing is not good for PCB incoming material control
Remove moisture or dirt from the PCB
Too much pressure on the printing paste reduces the pressure on the printing spatula
Solder powder oxidation, flux change solder paste
Adjust the furnace temperature curve by heating up too quickly in preheating zone
Too fast track speed reduces the reflow track speed